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[Measurement Example] Measurement of Thermal Conductivity of High Thermal Conductivity Resin [TA]

Thermal conductivity distribution measurement and the anisotropy of thermal diffusivity in each part can be evaluated.

In recent years, the miniaturization and high output of electronic devices have rapidly advanced, and as a result, thermal management (heat dissipation) has become a very important issue. Traditionally, heat dissipation has been maintained by using metals, but in recent years, it has begun to be replaced by "high thermal conductivity resins." High thermal conductivity resins are "lightweight" and have "moldability" compared to traditional metals, are "corrosion-resistant," and above all, have the advantage of being "low-cost." However, there is also the disadvantage of low thermal conductivity, and many material manufacturers are actively developing solutions to address this issue. It is expected that "high thermal conductivity resins" will become mainstream in the future. On the thermal properties blog, we introduce examples of thermal conductivity measurements of "high thermal conductivity resins." http://blog.thermal-measurement.info/archives/cat_50051425.html

• Company：ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
• Price：Other

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